Free tool

Solder Joint Thermal Cycling Life Calculator

Solder joints fail from the size of the temperature swing, not from the heat. Scale a qualification test to your field conditions and see how many cycles the joints actually survive.

Acceleration factor
test vs field
Field cycles survived
implied by the test
Field life
Cycles needed
for your service life

Runs entirely in your browser. Nothing is uploaded, stored, or sent anywhere.

Solder joints fail from the swing, not the heat

A solder joint sits between a package and a board with different coefficients of thermal expansion. Every temperature change shears it, the joint deforms plastically, and after enough cycles a crack propagates through. The damage per cycle depends overwhelmingly on how far the temperature moves, not on how hot it gets.

Nf ∝ ΔT−n  — Coffin-Manson, n ≈ 2 for SAC alloys
AF = (ΔTtest/ΔTfield)n · exp[ Ea/k · (1/Tmax,field − 1/Tmax,test) ]  — Norris-Landzberg

With n = 2, halving the temperature swing quadruples the life. That dominates everything else in the model. A design that cycles 40 K survives roughly four times as many cycles as one that swings 80 K, regardless of the absolute temperature either runs at.

What this changes about thermal design

The usual thermal goal is to keep the junction cool, and for silicon reliability and electrolytic capacitor life that is right — both follow Arrhenius, where absolute temperature is what matters. Solder fatigue does not. A part that runs steadily hot can outlast one that runs cool but power-cycles hard.

So the levers are different: thermal mass and heat spreading that slow and shrink the swing, avoiding aggressive power gating on large packages, and being wary of duty cycles that happen to align with the product's thermal time constant. For the Arrhenius side of the same board see the capacitor life and board FIT tools — they pull in a different direction, and a real design has to satisfy both.

Using a qualification test to predict field life

The acceleration factor is what lets a 1000-cycle −40/+125 °C test say something about ten years in a cabinet. Enter what the test survived and the field conditions, and the tool scales one to the other. Norris-Landzberg adds the maximum-temperature term to plain Coffin-Manson, which matters when the test and the field differ a lot in peak temperature — and they usually do.

A first-order model of a complex failure. Real fatigue life depends on package type and size, standoff height, pad geometry, underfill, board thickness, dwell time at temperature, ramp rate, and the alloy. A BGA and a chip resistor on the same board have very different lives under the same cycle. Exponents in the range 1.9–2.5 are common for SAC; use a value from your own qualification data if you have it, and treat the absolute cycle counts as comparative rather than predictive.

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